Serial Processor
As the name of both implies: * Serial processing: you take a list of items and do whatever you want to do with them one by one. It will take as long to complete the task as there are items in your list. * Parallel processing: you have means of d. Parallel Processing: Sometimes They Look like Tweedledum and Tweedledee but They. Can (And Should) be Distinguished. Author(s): James T. Source: Psychological Science, Vol. 1 (Jan., 1990), pp. Published by: Blackwell Publishing on behalf of the Association for Psychological.
Greetings from Intel Software Network Support. Yes, Application Note 485, Intel Processor Identification and the CPUID Instruction, is also available directly from the Intel web site:. We also recommend the CPUID section of the IA-32 Intel Architecture Software Developers Manuals, vol.
2, Instruction Set Reference: To learn how to use the CPUID instruction to read the Processor Serial Number whenthere is a serial number present, see AP-909, Intel Processor Serial Number: Looking *, it appears that versions of MASM* dating back to 1995 have been capable of dealing with the CPUID instruction. However, keep in mind that only the Pentium III Xeon, Mobile Pentium III and Pentium III processors support the processor serial number feature introduced by the Pentium III processor. No other Intel processor supports the processor serial number feature: It looks like the was the one being made available for compatibility with the Intel Pentium III processor at the time.
For additional Processor Serial Number (PSN) information from support.intel.com,please see: You might also be interested in this * articlewritten about coding forthe Pentium III processor when it first came out. Regards, Lexi S. Intel Software Network Support Message Edited by intel.software.network.support on 08:57 PM. First of all thanks a lot for your support. I got all these valuable documents for my analysis.
Now I have the last question about the assembler. Why, when I look for assembly, I see that a lot of people use MASM dated 1993, 1994 1995??? All very old version of assembler.
May be because not much people use assembler or because many of them prefer to use a mix of C/C++ and 'inline' assembler or other? Then, the final question is: what is, today, the 'state of art' assembler compiler for Intel CPU from Intel or other sw vendor? Thanks again, Mario.
There are many stand-alone assemblers around. I prefer to use 'MASM', currently called 'ML', the one issued by Microsoft, because it allows me to debug ASM-routines within C programs as well as inline-asm parts. (I code using Visual C). ML.EXE closely follows the conventions and mnemonics as in Intel's documentations. This compiler is distributed as an integral part of the VC package, usually called 'ML.EXE' or 'ML64.exe' for 64-bit version. You have one version to compile 64-bit instructions on a 32-bit system, and one for 64-bit code compiled on a 64-bit systems (I failed to find a difference). Search your own VC directory.
In my VC, the 64-bit version on 64-bit system is in path 'C: Program Files (x86) Microsoft Visual Studio 9.0 VC bin x86_amd64 ml64.exe' The Intel C compiler allows using 64-bit inline assembler. My VC C-compiler does not. So, I recommend using Intel compiler.
ML64.EXE works with both.
• • • Predecessor Successor,,, The Pentium III (marketed as Intel Pentium III Processor, informally PIII, also stylized as pentium!!!) brand refers to 's desktop and mobile based on the sixth-generation introduced on February 26, 1999. The brand's initial processors were very similar to the earlier -branded microprocessors. The most notable differences were the addition of the (to accelerate and parallel calculations), and the introduction of a controversial serial number embedded in the chip during the manufacturing process. Contents • • • • • • • • • • • • • • • Processor cores [ ] Similarly to the Pentium II it superseded, the Pentium III was also accompanied by the brand for lower-end versions, and the for high-end (server and workstation) derivatives. The Pentium III was eventually superseded by the, but its core also served as the basis for the, which used many ideas from the. Subsequently, it was the of Pentium M branded CPUs, and not the found in processors, that formed the basis for Intel's energy-efficient of CPUs branded,,, and Xeon.
Intel Pentium III processor family Standard Logo (1999-2002) Mobile Logo (1999-2003) Code-named Core Date released Katmai Coppermine Coppermine T Tualatin (250 nm) (180 nm) (180 nm) (130 nm) May 1999 Mar 2000 Aug 2000 Apr 2001 Katmai [ ]. A Pentium III Katmai SECC2 cartridge with heatsink removed. The first Pentium III variant was the Katmai (Intel product code 80525). It was a further development of the Pentium II.
The Pentium III saw an increase of 2 million transistors over the Pentium II. The differences were the addition of execution units and SSE instruction support, and an improved L1 cache controller [ ] (the L2 cache controller was left unchanged, as it would be completely redesigned for Coppermine anyway), which were responsible for the minor performance improvements over the 'Deschutes' Pentium IIs. It was first released at speeds of 450 and 500 MHz in February 1999. Two more versions were released: 550 MHz on May 17, 1999 and 600 MHz on August 2, 1999. On September 27, 1999 Intel released the 533B and 600B running at 533 & 600 MHz respectively.
The 'B' suffix indicated that it featured a 133 MHz FSB, instead of the 100 MHz FSB of previous models. The Katmai contains 9.5 million transistors, not including the 512 Kbytes L2 cache (which adds 25 million transistors), and has dimensions of 12.3 mm by 10.4 mm (128 mm 2). It is fabricated in Intel's P856.5 process, a 0.25 micrometre CMOS process with five levels of aluminum interconnect.
The Katmai used the same slot-based design as the Pentium II but with the newer cartridge that allowed direct CPU core contact with the heat sink. There have been some early models of the Pentium III with 450 and 500 MHz packaged in an older SECC cartridge intended for. A notable for enthusiasts was SL35D. This version of Katmai was officially rated for 450 MHz, but often contained cache chips for the 600 MHz model and thus usually was capable of running at 600 MHz. Coppermine [ ]. A 900 MHz Coppermine FC-PGA Pentium III.
The second version, codenamed Coppermine (Intel product code: 80526), was released on October 25, 1999, running at 500, 533, 550, 600, 650, 667, 700, and 733 MHz. From December 1999 to May 2000, Intel released Pentium IIIs running at speeds of 750, 800, 850, 866, 900, 933 and 1000 MHz (1 GHz). Both 100 MHz FSB and 133 MHz FSB models were made. For models that were already available with the same frequency, an 'E' was appended to the model name to indicate cores using the new 0.18 μm fabrication process.
An additional 'B' was later appended to designate 133 MHz FSB models, resulting in an 'EB' suffix. In terms of overall performance, the Coppermine held a slight advantage over the AMD Athlons it was released against, which was reversed when AMD applied their own die shrink and added an on-die L2 cache to the Athlon. Athlon held the advantage in floating-point intensive code, while the Coppermine could perform better when SSE optimizations were used, but in practical terms there was little difference in how the two chips performed, clock-for-clock. However, AMD were able to clock the Athlon higher, reaching speeds of 1.2 GHz before the launch of the Pentium 4. In terms of performance, Coppermine arguably marked a bigger step than Katmai by introducing an on-chip L2 cache (which Intel called Advanced Transfer Cache, or ATC). The ATC operates at the core clock rate and has a capacity of 256 KB, twice that of the on-chip cache previously seen on Mendocino Celerons.
It is eight-way and is accessed via a Double Quad Word Wide 256-bit bus, four times as wide as Katmai's. Furthermore, latency was dropped to a quarter compared to Katmai.
Another marketing term by Intel was Advanced System Buffering, which encompassed improvements to better take advantage of a 133 MHz system bus. These include 6 fill buffers (vs. 4 on Katmai), 8 bus queue entries (vs. 4 on Katmai) and 4 write-back buffers (vs.
1 on Katmai). Download Free Ohmforce Ohmicide Mac Crack 2016 - Download And Torrent. Under competitive pressure from the, Intel re-worked the internals, finally removing some well-known pipeline stalls. [ ] The result was that applications affected by these pipeline stalls ran faster on the Coppermine by up to 30%.
[ ] The Coppermine contained 29 million transistors and was fabricated in a 0.18 process. Although its codename gives the impression that it used, its interconnects were in fact aluminium. The Coppermine was packaged in a 370-pin FC-PGA or FC-PGA2 for use with, or in SECC2 for Slot 1. Early PGA versions have an exposed die, whereas higher frequency SKUs (866, 933, 1000EB, 1133) were also produced in an FC-PGA2 variant with (IHS) to improve contact between the die and the. This in itself did not improve thermal conductivity, since it added another layer of metal and between the die and the heatsink, but it greatly assisted in holding the heatsink flat against the die. Earlier Coppermines without the IHS made heatsink mounting challenging.
If the heatsink was not flat against the die, heat transfer efficiency was greatly reduced. Some heatsink manufacturers began providing pads on their products, similar to what AMD did with the 'Thunderbird' Athlon to ensure that the heatsink was mounted flatly. The enthusiast community went so far as to create shims to assist in maintaining a flat interface. A 1.13 GHz version was released in mid-2000 but famously recalled after a collaboration between and discovered various instabilities with the operation of the new CPU speed grade. The Coppermine core was unable to reliably reach the 1.13 GHz speed without various tweaks to the processor's microcode, effective cooling, additional voltage (1.75 V vs. 1.65 V), and specifically validated platforms. Intel only officially supported the processor on its own VC820 -based motherboard, but even this motherboard displayed instability in the independent tests of the hardware review sites.
In benchmarks that were stable, performance was shown to be sub-par, with the 1.13 GHz CPU equalling a 1.0 GHz model. Tom's Hardware attributed this performance deficit to relaxed tuning of the CPU and motherboard to improve stability. Intel needed at least six months to resolve the problems using a new cD0 stepping and re-released 1.1 GHz and 1.13 GHz versions in 2001. 's uses a variant of the Pentium III/Mobile Celeron family in a form factor. The sSpec designator of the chips is SL5Sx, which makes it most similar to the Mobile Celeron processor. It shares with the Coppermine-128 Celeron its 128 KB L2 cache, and 180 nm process technology, but keeps the 8-way cache associativity from the Pentium III. Coppermine T [ ] This revision is an intermediate step between Coppermine and Tualatin, with support for lower-voltage system logic present on the latter but core power within previously defined voltage specs of the former so it could work in older system boards.
Intel used the latest Coppermines with the cD0-Stepping and modified them so that they worked with low voltage system bus operation at 1.25 V as well as normal 1.5 V signal levels, and would auto detect differential or single-ended clocking. This modification made them compatible to the latest generation Socket-370 boards supporting FC-PGA2 packaged CPUs while maintaining compatibility with the older FC-PGA boards. The Coppermine T also had two way symmetrical multiprocessing capabilities, but only in FC-PGA2 boards. They can be distinguished from Tualatin processors by their part numbers, which include the digits: 80533 e.g. The 1133 MHz SL5QK P/N is: RK80533PZ006256, while the 1000 MHz SL5QJ P/N is: RK80533PZ001256. Tualatin [ ]. A 1.13 GHz FC-PGA2 Tualatin-256 Intel Pentium III-T.
The third revision, Tualatin (80530), was a trial for Intel's new 0.13 µm process. Tualatin-based Pentium IIIs were released during 2001 until early 2002 at speeds of 1.0, 1.13, 1.2, 1.26, 1.33 and 1.4 GHz. A basic shrink of Coppermine, no new features were added, except for added data prefetch logic similar to Pentium 4 and Athlon XP for potentially better use of the L2 cache, although its use compared to these newer CPUs is limited due to the relatively smaller FSB bandwidth (FSB was still kept at 133 MHz).
Variants with 256 and 512 KB L2 cache were produced, the latter being dubbed Pentium III-S; this variant was mainly intended for low-power consumption servers and also exclusively featured SMP support within the Tualatin line. Although the Socket 370 designation was kept, the use of 1.25 AGTL signaling in place of 1.5V AGTL+ rendered previous motherboards incompatible. This confusion carried over to the chipset naming, where only the B-stepping of the i815 chipset was compatible with Tualatin processors. A new VRM guideline was also designed by Intel, version 8.5, which required finer voltage steps and debuted load line Vcore (in place of fixed voltage regardless of current on 8.4). Some motherboard manufacturers would mark the change with blue sockets (instead of white), and were often also backwards compatible with Coppermine CPUs. The Tualatin also formed the basis for the highly popular Pentium III-M mobile processor, which became Intel's front-line mobile chip (the Pentium 4 drew significantly more power, and so was not well-suited for this role) for the next two years. The chip offered a good balance between power consumption and performance, thus finding a place in both performance notebooks and the 'thin and light' category.
The Tualatin-based Pentium III performed well in some applications compared to the fastest Willamette-based Pentium 4, and even the Thunderbird-based Athlons. Despite this, its appeal was limited due to the aforementioned incompatibility with existing systems, and Intel's only officially supported chipset for Tualatins (except 3rd party server-line chipsets found on expensive server boards), the i815, could only handle 512 MB RAM and had slightly inferior performance because of a maximum in-order queue depth of 4, compared to 8 with the older, incompatible 440BX chipset. However, the enthusiast community found a way to run Tualatins on then-ubiquitous BX chipset based boards, although it was often a non-trivial task and required some degree of technical skills. Tualatin-based Pentium III CPUs can usually be visually distinguished from Coppermine-based processors by the metal integrated heat-spreader (IHS) fixed on top of the package. However, the very last models of Coppermine Pentium IIIs also featured the IHS — the integrated heat spreader is actually what distinguishes the FC-PGA2 package from the — both are for Socket 370 motherboards. Before the addition of the heat spreader, it was sometimes difficult to install a heatsink on a Pentium III. One had to be careful not to put force on the core at an angle because doing so would cause the edges and corners of the core to crack and could destroy the CPU.
It was also sometimes difficult to achieve a flat mating of the CPU and heatsink surfaces, a factor of critical importance to good heat transfer. This became increasingly challenging with the Socket 370 CPUs, compared with their predecessors, because of the force required to mount a socket-based cooler and the narrower, 2-sided mounting mechanism (Slot 1 featured 4-point mounting). As such, and because the 0.13 µm Tualatin had an even smaller core surface area than the 0.18 µm Coppermine, Intel installed the metal heatspreader on Tualatin and all future desktop processors. The Tualatin core was named after the and in, where Intel has large manufacturing and design facilities. Pentium III's SSE implementation [ ]. Slot 1 Pentium III CPU mounted on a motherboard Since Katmai was built in the same 0.25 µm process as Pentium II 'Deschutes', it had to implement using as little silicon as possible.
To achieve this goal, Intel implemented the 128-bit architecture by the existing 64-bit data paths and by merging the SIMD-FP multiplier unit with the x87 scalar FPU multiplier into a single unit. To utilize the existing 64-bit data paths, Katmai issues each SIMD-FP instruction as two. To compensate partially for implementing only half of SSE’s architectural width, Katmai implements the SIMD-FP adder as a separate unit on the second dispatch port. This organization allows one half of a SIMD multiply and one half of an independent SIMD add to be issued together bringing the peak throughput back to four floating point operations per cycle — at least for code with an even distribution of multiplies and adds. The issue was that Katmai’s hardware-implementation contradicted the parallelism model implied by the SSE instruction-set. Programmers faced a code-scheduling dilemma: Should the SSE-code be tuned for Katmai's limited execution resources, or should it be tuned for a future processor with more resources?
Katmai-specific SSE optimizations yielded the best possible performance from the Pentium III family but was suboptimal for Coppermine onwards as well as future Intel processors, such as the Pentium 4 and Core 2 Duo. Core specifications [ ]. •,, archived from on April 6, 2008, retrieved August 11, 2007 • ^ (March 8, 1999).
Volume 13, Number 3. Retrieved September 1, 2017. • Pabst, Thomas (October 25, 1999).. Retrieved September 1, 2017. •, The Tech Zone, April 12, 2000.
• Verbist, Tim., Overclockers Online, December 3, 2000. • ^ Pabst, Thomas.. Tom's Hardware. • Pabst, Thomas., Tom's Hardware, August 28, 2000. •, retrieved July 8, 2010 • • • • • • • Lal Shimpi, Anand., Anandtech, July 30, 2001. • Jagannath Keshava, Vladimir Pentkovski (1999). Intel Technology Journal.
Retrieved September 1, 2017. Retrieved September 1, 2017. •,, November 29, 1999. External links [ ] • • • Intel datasheets • • •.